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| Freescale Semiconductor Technical Data MPX5700 Rev 8, 01/2007 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPX5700 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features * * * * * 2.5% Maximum Error over 0 to 85C Ideally Suited for Microprocessor or Microcontroller-Based Systems Available in Absolute, Differential and Gauge Configurations Patented Silicon Shear Stress Strain Gauge Durable Epoxy Unibody Element ORDERING INFORMATION Device Type Basic Element Ported Elements Options Differential Absolute Differential Dual Ports Gauge Gauge, Axial Absolute Absolute, Axial Absolute, Axial PC Mount Case Type 867 867 867C 867B 867E 867B 867E 867F MPX Series Order Number Device Marking MPX5700D MPX5700A MPX5700DP MPX5700GP MPX5700GS MPX5700AP MPX5700AS MPX5700ASX MPX5700D MPX5700A MPX5700DP MPX5700GP MPX5700D MPX5700AP MPX5700A MPX5700A MPX5700 SERIES INTEGRATED PRESSURE SENSOR 0 to 700 kPa (0 to 101.5 psi) 15 to 700 kPa (2.18 to 101.5 psi) 0.2 to 4.7 V OUTPUT MPX5700D CASE 867-08 MPX5700AP CASE 867B-04 MPX5700DP CASE 867C-05 VS MPX5700AS CASE 867E-03 Sensing Element Thin Film Temperature Compensation and Gain Stage #1 Gain Stage #2 and Ground Reference Shift Circuitry Vout MPX5700ASX CASE 867F-03 PIN NUMBERS 1 Vout GND VS 4 5 6 N/C N/C N/C 2 3 GND Pins 4, 5, and 6 are no connects Figure 1. Fully Integrated Pressure Sensor Schematic NOTE: Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. (c) Freescale Semiconductor, Inc., 2007. All rights reserved. Table 1. Maximum Ratings(1) Parametrics Maximum Pressure (2) Symbol P1max Tstg TA Value 2800 -40 to +125 -40 to +125 Unit kPa C C (P2 1 Atmosphere) Storage Temperature Operating Temperature 1. Maximum Ratings apply to Case 867 only. Extended exposure at the specified limits may cause permanent damage or degradation to the device. 2. This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa. Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.) Characteristic Pressure Range(1) Gauge, Differential: MPX5700D Absolute: MPX5700A Symbol POP VS IO Gauge, Differential (0 to 85C) Absolute (0 to 85C) (0 to 85C) (0 to 85C) (0 to 85C) (7) Min 0 15 4.75 -- 0.088 0.184 4.587 -- -- -- -- -- -- Typ -- -- 5.0 7.0 0.2 -- 4.7 4.5 -- 6.4 1.0 0.1 20 Max 700 700 5.25 10 0.313 0.409 4.813 -- 2.5 --------- Unit kPa Vdc mAdc Vdc Vdc Vdc %VFSS mV/kPa ms mAdc ms Supply Voltage(2) Supply Current Zero Pressure Offset(3) Full Scale Output(4) Full Scale Span(5) Accuracy(6) Sensitivity Response Time Voff VFSO VFSS -- V/P tR IO+ -- Output Source Current at Full Scale Output Warm-Up Time(8) 1. 2. 3. 4. 5. 1.0 kPa (kiloPascal) equals 0.145 psi. Device is ratiometric within this specified excitation range. Offset (Voff) is defined as the output voltage at the minimum rated pressure. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized. Table 3. Mechanical Characteristics Characteristics Weight, Basic Element (Case 867) Typ 4.0 Unit grams MPX5700 2 Sensors Freescale Semiconductor ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING Figure 3 illustrates both the Differential/Gauge and the Absolute Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. (For use of the MPX5700D in a high-pressure cyclic application, consult the factory.) The MPX5700 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor 5.0 4.5 4.0 3.5 Output (V) 3.0 2.5 2.0 1.5 1.0 0.5 0 0 100 200 500 400 300 Differential Pressure (kPa) 600 700 800 Maximum Minimum performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Transfer Function: Vout = VS*(0.0012858*P+0.04) Error VS = 5.0 Vdc Temperature = 0 to 85C Typical Figure 2. Output versus Pressure Differential Fluoro Silicone Die Coat Wire Bond Fluoro Silicone Die Coat Wire Bond Die P1 Stainless Steel Metal Cover Die P1 Stainless Steel Metal Cover Lead Frame Epoxy Case P2 RTV Die Bond Lead Frame Epoxy Case P2 ABSOLUTE ELEMENT RTV Die Bond DIFFERENTIAL/GAUGE ELEMENT Figure 3. Cross-Sectional Diagrams (not to scale) +5 V Vout Vs IPS 1.0 F 0.01 F GND Output 470 pF Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646) MPX5700 Sensors Freescale Semiconductor 3 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The Freescale MPX Part Number MPX5700D, MPX5700A MPX5700DP MPX5700GP, MPX5700AP MPX5700GS, MPX5700AS MPX5700ASX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Case Type 867 867C 867B 867E 867F Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached Side with Port Attached MPX5700 4 Sensors Freescale Semiconductor PACKAGE DIMENSIONS C R M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 6 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30 NOM 30 NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66 L -TG F D 6 PL 0.136 (0.005) M J S TA M DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX STYLE 2: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND -VOUT VSUPPLY +VOUT OPEN STYLE 3: PIN 1. 2. 3. 4. 5. 6. CASE 867-08 ISSUE N BASIC ELEMENT P 0.25 (0.010) X R PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) M TQ M -AU W L V NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06 PORT #2 VACUUM (P2) N PORT #1 POSITIVE PRESSURE (P1) -QB PIN 1 1 2 3 4 5 6 K S C SEATING PLANE DIM A B C D F G J K L N P Q R S U V W X -T- -TJ SEATING PLANE G F D 6 PL 0.13 (0.005) M A M STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX CASE 867C-05 ISSUE F PRESSURE AND VACUUM SIDES PORTED (DP) MPX5700 Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G PRESSURE SIDE PORTED (AP, GP) MPX5700 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G PRESSURE SIDE PORTED (AP, GP) MPX5700 Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS C A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS MAX MIN MAX MIN 18.28 0.720 17.53 0.690 6.48 6.22 0.245 0.255 20.82 0.780 0.820 19.81 0.84 0.69 0.027 0.033 4.72 4.52 0.178 0.186 1.63 1.22 0.048 0.064 0.100 BSC 2.54 BSC 0.41 0.36 0.014 0.016 9.53 8.76 0.375 0.345 7.87 7.62 0.300 0.310 6.10 5.59 0.220 0.240 4.93 4.62 0.194 0.182 STYLE 1: PIN 1. 2. 3. 4. 5. 6. -B- V PIN 1 PORT #1 POSITIVE PRESSURE (P1) 6 5 4 3 2 1 K S G F D 6 PL 0.13 (0.005) M J N E -T- DIM A B C D E F G J K N S V TB M VOUT GROUND VCC V1 V2 VEX CASE 867E-03 ISSUE D PRESSURE SIDE PORTED (AS, GS) -TC E A U -Q- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MAX MIN MIN MAX 28.45 27.43 1.080 1.120 19.30 18.80 0.740 0.760 16.51 16.00 0.630 0.650 0.84 0.68 0.027 0.033 4.57 4.06 0.160 0.180 1.63 1.22 0.048 0.064 0.100 BSC 2.54 BSC 0.41 0.36 0.014 0.016 6.10 5.59 0.220 0.240 2.03 1.78 0.070 0.080 4.06 3.81 0.150 0.160 4.06 3.81 0.150 0.160 11.68 11.18 0.440 0.460 18.42 17.65 0.695 0.725 21.84 21.34 0.840 0.860 4.93 4.62 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6. V N B R PORT #1 POSITIVE PRESSURE (P1) PIN 1 -P0.25 (0.010) M TQ M 6 5 4 3 2 1 S K J 0.13 (0.005) M TP S D 6 PL QS F G VOUT GROUND VCC V1 V2 VEX CASE 867F-03 ISSUE D PRESSURE SIDE AXIAL PORT (ASX) MPX5700 8 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2007. All rights reserved. MPX5700 Rev. 8 01/2007 |
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